The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Nov. 01, 2013
James D. Sampica, Springville, IA (US);
Paul R. Nemeth, Cedar Rapids, IA (US);
Tracy J. Barnidge, Marion, IA (US);
Vincent P. Marzen, Robins, IA (US);
James D. Sampica, Springville, IA (US);
Paul R. Nemeth, Cedar Rapids, IA (US);
Tracy J. Barnidge, Marion, IA (US);
Vincent P. Marzen, Robins, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
The present invention is a process for performing a planarization treatment of pressure-sensitive adhesive (PSA). The process includes positioning a first substrate onto a support surface of a planarization tool. The process further includes placing at least one layer of PSA onto the first substrate. The process further includes positioning a second substrate onto the layer(s) of PSA. The process further includes applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner. Further, the applied pressure flattens the PSA between the first substrate and the second substrate for promoting suitability of the PSA for use in rigid-to-rigid lamination processes.