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For the Inventor, By the Inventor

Plano, TX, United States of America

James Cooper Wainerdi

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2011-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James Cooper Wainerdi. Retrieved from https://idiyas.com/inventor/james-cooper-wainerdi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:

goldMedal8 out of 29,973 
 
Texas Instruments Corporation
 patents

Years Active: 2011-2021

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8 patents (USPTO):Explore Patents
1. 11082028 - 3D-printed protective shell structures with support columns for stress sensitive circuits (2021-08-03),
2. 10516381 - 3D-printed protective shell structures for stress sensitive circuits (2019-12-24),
3. 9517938 - Applying spatial gradient magnetic field to metallic/semiconducting SWNTs in fluid (2016-12-13),
4. 9114995 - Separating Metallic and Semiconductor SWNTS with sinusoidal dipole-inducing magnetic fields (2015-08-25),
5. 8789705 - Separating metallic and semiconductor SWNTs with varying dipole-inducing magnetic fields (2014-07-29),
6. 8753924 - Grown carbon nanotube die attach structures, articles, devices, and processes for making them (2014-06-17),
7. 8378506 - Packaged electronic device having metal comprising self-healing die attach material (2013-02-19),
8. 7972905 - Packaged electronic device having metal comprising self-healing die attach material (2011-07-05),

Title: Innovations of James Cooper Wainerdi

Introduction

James Cooper Wainerdi is a notable inventor based in Plano, Texas. He has made significant contributions to the field of semiconductor packaging, holding a total of eight patents. His work focuses on enhancing the reliability and performance of stress-sensitive circuits through innovative protective shell structures.

Latest Patents

Wainerdi's latest patents include advancements in 3D-printed protective shell structures designed for stress-sensitive circuits. One of his patents describes a semiconductor package that features a lead frame with a semiconductor die attached to its first side. A protective shell covers a portion of the semiconductor die's surface, utilizing ink residue as part of its composition. Additionally, a layer of molding compound encases the outer surface of the protective shell and the exposed area of the semiconductor die. The design incorporates a cavity space within the protective shell, enhancing the overall functionality and protection of the semiconductor package.

Career Highlights

Wainerdi has built a successful career at Texas Instruments Corporation, where he has been instrumental in developing innovative solutions for semiconductor technology. His expertise in 3D printing and materials science has positioned him as a leader in his field.

Collaborations

Throughout his career, Wainerdi has collaborated with esteemed colleagues, including Luigi Colombo and Robert R. Doering. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor packaging.

Conclusion

James Cooper Wainerdi's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and improve the performance of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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