Company Filing History:
Years Active: 2011-2021
Title: Innovations of James Cooper Wainerdi
Introduction
James Cooper Wainerdi is a notable inventor based in Plano, Texas. He has made significant contributions to the field of semiconductor packaging, holding a total of eight patents. His work focuses on enhancing the reliability and performance of stress-sensitive circuits through innovative protective shell structures.
Latest Patents
Wainerdi's latest patents include advancements in 3D-printed protective shell structures designed for stress-sensitive circuits. One of his patents describes a semiconductor package that features a lead frame with a semiconductor die attached to its first side. A protective shell covers a portion of the semiconductor die's surface, utilizing ink residue as part of its composition. Additionally, a layer of molding compound encases the outer surface of the protective shell and the exposed area of the semiconductor die. The design incorporates a cavity space within the protective shell, enhancing the overall functionality and protection of the semiconductor package.
Career Highlights
Wainerdi has built a successful career at Texas Instruments Corporation, where he has been instrumental in developing innovative solutions for semiconductor technology. His expertise in 3D printing and materials science has positioned him as a leader in his field.
Collaborations
Throughout his career, Wainerdi has collaborated with esteemed colleagues, including Luigi Colombo and Robert R. Doering. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor packaging.
Conclusion
James Cooper Wainerdi's contributions to the field of semiconductor technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and improve the performance of electronic devices.