Texas Instruments Corporation

James Cooper Wainerdi

Luigi Colombo

Robert R Doering

John Paul Tellkamp

Luu Thanh Nguyen

Matthew David Romig

Alexander Harvey Scheuermann

In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.

3D-printed protective shell structures with support columns for stress sensitive circuits

3D-printed protective shell structures for stress sensitive circuits

A process of sorting metallic single wall carbon nanotubes (SWNTs) from semiconducting types by disposing the SWNTs in a dilute fluid, exposing the SWNTs to a dipole-inducing magnetic field which induces magnetic dipoles in the SWNTs so that a strength of a dipole depends on a conductivity of the SWNT containing the dipole, orienting the metallic SWNTs, and exposing the SWNTs to a magnetic field with a spatial gradient so that the oriented metallic SWNTs drift in the magnetic field gradient and thereby becomes spatially separated from the semiconducting SWNTs. An apparatus for the process of sorting SWNTs is disclosed.

Applying spatial gradient magnetic field to metallic/semiconducting SWNTs in fluid

Separating Metallic and Semiconductor SWNTS with sinusoidal dipole-inducing magnetic fields

Separating metallic and semiconductor SWNTs with varying dipole-inducing magnetic fields

An article of manufacture includes a semiconductor die () having an integrated circuit () on a first side of the die (), a diffusion barrier () on a second side of the die () opposite the first side, a mat of carbon nanotubes () rooted to the diffusion barrier (), a die attach adhesive () forming an integral mass with the mat () of the carbon nanotubes, and a die pad () adhering to the die attach adhesive and () and the mat () of carbon nanotubes for at least some thermal transfer between the die () and the die pad () via the carbon nanotubes (). Other articles, integrated circuit devices, structures, and processes of manufacture, and assembly processes are also disclosed.

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive precursor includes metal particles, a first plurality of first microcapsules having a polymerizable material inside, and a second plurality of second microcapsules having a polymerization agent inside to form a first polymer upon rupture of first and second microcapsules. A force sufficient to rupture at least a portion of the first plurality of first microcapsules and at least a portion of the second plurality of second microcapsules is applied to form a self-healing die attach adhesive wherein the first polymer binds the plurality of metal particles and the remaining microcapsules and secures the IC die to the top surface of the workpiece. The self-healing die attach adhesive generally includes at least 90 vol. % metal.

Growing community of inventors

Plano, TX, United States of America

James Cooper Wainerdi