Rancho Palos Verdes, CA, United States of America

James A Hathaway

This inventor holds 2 USPTO granted patents. Top assignee: Northrop Grumman Systems Corporation. Active years: 2004-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James A Hathaway. Retrieved from https://idiyas.com/inventor/james-a-hathaway-560jw9t5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Rancho Palos Verdes, CA (US) (2004)
  • Ranchos Palos Verdes, CA (US) (2005)

Company Filing History:


Years Active: 2004-2005

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2 patents (USPTO):Explore Patents

Title: Innovations of James A. Hathaway

Introduction

James A. Hathaway is a notable inventor based in Ranchos Palos Verdes, California. He has made significant contributions to the field of electronic device packaging and photonics. With a total of two patents to his name, Hathaway's work showcases his expertise and innovative spirit.

Latest Patents

Hathaway's latest patents include an "Ultra Wideband BGA," which is an electronic device packaging assembly designed to operate from DC up to 50 GHz with minimal parasitic losses. This packaging assembly features a thin base plate made of a suitable rigid material, with power vias, signal vias, and ground vias formed through the base plate to connect to traces, circuit components, and/or the device within the assembly. Additionally, an impedance matching compensation network is included to ensure proper impedance matching between the device and the signal vias. The ball grid array consists of multiple solder balls, including ground, signal, and power solder balls, all electrically coupled to the appropriate vias extending through the base plate.

Another significant patent is the "Process for Fabricating a Photonics Package and for Aligning an Optical Fiber with a Photodetector Surface During Fabrication of Such a Package." This process involves securing a ferrule to an optical fiber and inserting it through a movable flange into a photonics housing containing a photodiode. The ferrule is then adjusted longitudinally to position the optical fiber's end with respect to the photodiode surface. The assembly is further adjusted laterally and secured to the housing using hot gas injection or laser soldering, allowing for precise final positioning.

Career Highlights

James A. Hathaway is currently employed at Northrop Grumman Systems Corporation, where he continues to innovate and contribute to advancements in technology. His work has had a significant impact on the development of electronic packaging and photonics.

Collaborations

Hathaway has collaborated with notable coworkers such as Brian F. Crossman and Salah Din, further enhancing the innovative environment in which he works.

Conclusion

James A. Hathaway's contributions to the fields of electronic device packaging and photonics highlight his role as a leading inventor. His patents reflect a commitment to innovation and excellence in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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