This inventor holds 2 USPTO granted patents. Top assignee: Northrop Grumman Systems Corporation. Active years: 2004-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Rancho Palos Verdes, CA (US) (2004)
- Ranchos Palos Verdes, CA (US) (2005)
Company Filing History:
Years Active: 2004-2005
Title: Innovations of James A. Hathaway
Introduction
James A. Hathaway is a notable inventor based in Ranchos Palos Verdes, California. He has made significant contributions to the field of electronic device packaging and photonics. With a total of two patents to his name, Hathaway's work showcases his expertise and innovative spirit.
Latest Patents
Hathaway's latest patents include an "Ultra Wideband BGA," which is an electronic device packaging assembly designed to operate from DC up to 50 GHz with minimal parasitic losses. This packaging assembly features a thin base plate made of a suitable rigid material, with power vias, signal vias, and ground vias formed through the base plate to connect to traces, circuit components, and/or the device within the assembly. Additionally, an impedance matching compensation network is included to ensure proper impedance matching between the device and the signal vias. The ball grid array consists of multiple solder balls, including ground, signal, and power solder balls, all electrically coupled to the appropriate vias extending through the base plate.
Another significant patent is the "Process for Fabricating a Photonics Package and for Aligning an Optical Fiber with a Photodetector Surface During Fabrication of Such a Package." This process involves securing a ferrule to an optical fiber and inserting it through a movable flange into a photonics housing containing a photodiode. The ferrule is then adjusted longitudinally to position the optical fiber's end with respect to the photodiode surface. The assembly is further adjusted laterally and secured to the housing using hot gas injection or laser soldering, allowing for precise final positioning.
Career Highlights
James A. Hathaway is currently employed at Northrop Grumman Systems Corporation, where he continues to innovate and contribute to advancements in technology. His work has had a significant impact on the development of electronic packaging and photonics.
Collaborations
Hathaway has collaborated with notable coworkers such as Brian F. Crossman and Salah Din, further enhancing the innovative environment in which he works.
Conclusion
James A. Hathaway's contributions to the fields of electronic device packaging and photonics highlight his role as a leading inventor. His patents reflect a commitment to innovation and excellence in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
