The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2005
Filed:
Jul. 01, 2003
James A. Hathaway, Ranchos Palos Verdes, CA (US);
Brian F. Crossman, Laguna Niguel, CA (US);
Salah Din, Buena Park, CA (US);
James A. Hathaway, Ranchos Palos Verdes, CA (US);
Brian F. Crossman, Laguna Niguel, CA (US);
Salah Din, Buena Park, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
An electronic device packaging assembly () that includes a ball grid array () and specialized construction to be able to operate from DC up to 50 GHz with minimal parasitic losses. The packaging assembly () includes a thin base plate () made of a suitable rigid material. Power vias (), signal vias () and ground vias () are formed through the base plate () to be coupled to traces, circuit components, and/or the device () within the packaging assembly (). An impedance matching compensation network () provides impedance matching between the device () and the signal vias (). The ball grid array () includes a plurality of solder balls (), including ground solder balls (), signal solder balls () and power solder balls (), electrically coupled to the appropriate via extending through the base plate ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile