Shanghai, China

Jaiwen Zhao

This inventor holds 1 USPTO granted patent. Top assignee: Henkel Ag & Company, Kgaa. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaiwen Zhao. Retrieved from https://idiyas.com/inventor/jaiwen-zhao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Jaiwen Zhao in Silver Sintering Technology.

Introduction

Jaiwen Zhao is a notable inventor based in Shanghai, China. He has made significant contributions to the field of metal bonding through his innovative work in silver sintering compositions. His expertise and inventions have garnered attention in the industry, particularly for their practical applications.

Latest Patents

Jaiwen Zhao holds a patent for a silver sintering composition containing a copper alloy for metal bonding. This invention relates specifically to a silver sintering composition that is capable of being stably sintered on various metal substrates such as copper, gold, or silver. The composition demonstrates good adhesion and sintering strength, making it a valuable advancement in the field.

Career Highlights

Jaiwen Zhao is currently employed at Henkel AG & Company, KGaA, where he continues to develop innovative solutions in material science. His work has positioned him as a key figure in the advancement of metal bonding technologies.

Collaborations

Throughout his career, Jaiwen has collaborated with talented individuals such as Wei Yao and Yang Ti. These partnerships have contributed to the success of his projects and the development of new technologies.

Conclusion

Jaiwen Zhao's contributions to silver sintering technology highlight his role as an influential inventor in the field. His innovative patent and ongoing work at Henkel AG & Company, KGaA demonstrate his commitment to advancing metal bonding solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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