The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2024

Filed:

Jun. 17, 2022
Applicant:

Henkel Ag & Co., Kgaa, Dusseldorf, DE;

Inventors:

Wei Yao, Shanghai, CN;

Yang Ti, Shanghai, CN;

Jaiwen Zhao, Shanghai, CN;

Qili Wu, Shanghai, CN;

Assignee:

HENKEL AG & CO. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/052 (2022.01); B22F 1/10 (2022.01); H01L 23/00 (2006.01); B22F 1/0545 (2022.01); B22F 1/102 (2022.01); B22F 1/107 (2022.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/052 (2022.01); B22F 1/10 (2022.01); H01L 24/29 (2013.01); B22F 1/0545 (2022.01); B22F 1/102 (2022.01); B22F 1/107 (2022.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0665 (2013.01); Y10T 428/12014 (2015.01);
Abstract

This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.


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