Company Filing History:
Years Active: 2024-2025
Title: Innovations by Inventor Yang Ti
Introduction
Yang Ti is a notable inventor based in Shanghai, China. He has made significant contributions to the field of conductive materials, particularly in the development of epoxy resin compositions and sintering technologies. With a total of 2 patents, his work has implications for various applications in electronics and semiconductor devices.
Latest Patents
Yang Ti's latest patents include a "Conductive epoxy resin composition for copper bonding." This invention focuses on a conductive epoxy resin composition specifically designed for bonding copper substrates. The cured product and its applications, including its use in semiconductor devices, highlight the innovation's relevance in modern technology. Another significant patent is the "Silver sintering composition containing copper alloy for metal bonding." This invention pertains to a silver sintering composition that includes a copper alloy, which can be stably sintered on various metal substrates such as copper, gold, or silver, ensuring good adhesion and sintering strength.
Career Highlights
Yang Ti is currently employed at Henkel AG & Company, KGaA, where he continues to advance his research and development efforts. His work at Henkel has allowed him to collaborate with leading experts in the field, further enhancing the impact of his inventions.
Collaborations
Some of Yang Ti's coworkers include Wei Yao and Qili Wu. Their collaborative efforts contribute to the innovative environment at Henkel, fostering advancements in material science.
Conclusion
Yang Ti's contributions to the field of conductive materials through his patents demonstrate his commitment to innovation and technology. His work not only enhances the capabilities of electronic devices but also paves the way for future advancements in the industry.