This inventor holds 2 USPTO granted patents. Top assignees: Advance Micro Devices, Inc., Advanced Micro Devices Corporation. Active years: 2003-2005.
Company Filing History:
1 out of 24 
1 out of 13,157 
Years Active: 2003-2005
Title: Innovations by Jaime D Weidler
Introduction
Jaime D Weidler is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the reliability and performance of semiconductor devices.
Latest Patents
Weidler's latest patents include a "Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrate." This invention addresses the issue of misalignment in semiconductor packaging assembly materials. It involves a method of fabricating a fully aligned flip-chip assembly that compensates for thermal expansion mismatches, resulting in a more robust assembly. Another significant patent is for a "Semiconductor packaging apparatus for controlling die attach fillet height to reduce die shear stress." This invention aims to prevent cracking and delamination in semiconductor chips by controlling the die attach material height, thereby enhancing wire-bond reliability and package reliability.
Career Highlights
Throughout his career, Weidler has worked with prominent companies such as Advanced Micro Devices Corporation and Advanced Micro Devices, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.
Collaborations
Weidler has collaborated with notable professionals in the field, including Robert A Newman and Jinsu Kwon. These collaborations have likely enriched his work and led to innovative solutions in semiconductor packaging.
Conclusion
Jaime D Weidler's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation and reliability in technology. His work continues to influence the industry positively.