Suwon, South Korea

Jaewon Shin

This inventor holds 1 USPTO granted patent. Top assignee: Semes Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaewon Shin. Retrieved from https://idiyas.com/inventor/jaewon-shin-nsggugk6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jaewon Shin and Substrate Processing Technology.

Introduction

Jaewon Shin is an inventor based in Suwon, South Korea. He is associated with Semes Co., Ltd., and his patent work includes an apparatus designed for processing substrates using plasma.

Latest Patents

Shin is named on one patent, titled “Substrate Processing Apparatus.” The invention describes a chamber with a processing space, a dielectric window covering the chamber, and an RF source that supplies power to generate plasma from gas inside the chamber. The RF source includes an electrode and a ring-shaped plate, while a vertical groove in the dielectric window forms part of the apparatus’s design. Shin’s record lists 1 patent.

Career Highlights

Shin’s listed patent connects his work at Semes Co., Ltd. with the development of substrate-processing equipment. The patent focuses on the arrangement of components used to generate plasma within a processing chamber.

Collaborations

Sangjeong Lee and Youngun Bong are identified as Shin’s coworkers. The available information does not specify their roles in the patent or whether they collaborated on this invention.

Conclusion

Jaewon Shin’s patent record highlights his association with Semes Co., Ltd. and an invention concerning plasma-based substrate processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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