This inventor holds 3 USPTO granted patents and 9 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jaesun Kim: Semiconductor Package Inventor
Introduction
Jaesun Kim is an inventor based in Suwon-si, South Korea, and is associated with Samsung Electronics Ltd. His patent work focuses on semiconductor packaging and the design of electrical connections within a redistribution structure.
Latest Patents
Kim is named on 1 patent: “Semiconductor Package Including a Pad Comprising a Connection Portion Connecting a First and Second Pad Portions.” The invention describes a semiconductor package with a redistribution structure made of alternating redistribution and insulating layers. A semiconductor chip and bumps connect electrically to the redistribution layers. Each pad facing a bump has first and second pad portions offset in different directions, joined by a connection portion. A protruding feature in that connection portion defines recessed regions beside the two pad portions.
Career Highlights
The available information identifies Kim’s work on semiconductor packaging and his association with Samsung Electronics Ltd. The patent describes a pad configuration intended for use in the electrical connections of a semiconductor package.
Collaborations
Sanghyun Lee and Yeonho Jang are listed as Kim’s coworkers. The provided information does not specify whether they collaborated with him on this patent.
Conclusion
Jaesun Kim’s listed patent concerns a distinctive pad structure for semiconductor packaging, reflecting his documented work in this area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile