The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
May. 25, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jaesun Kim, Suwon-si, KR;
Sanghyun Lee, Suwon-si, KR;
Yeonho Jang, Suwon-si, KR;
Yunseok Choi, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. A semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. The redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. The connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile