Company Filing History:
Years Active: 2012-2014
Title: The Innovations of Jaeseok Lee
Introduction
Jaeseok Lee is a prominent inventor based in Wilmington, DE (US). He has made significant contributions to the field of chemical mechanical polishing, particularly in the development of compositions and methods for polishing phase change alloys. With a total of 2 patents, his work has garnered attention in the electronics materials industry.
Latest Patents
Jaeseok Lee's latest patents include innovative methods for chemical mechanical polishing of substrates comprising germanium-antimony-tellurium chalcogenide phase change alloys. The first patent describes a method that utilizes a chemical mechanical polishing composition containing water, an abrasive, phthalic acid derivatives, a chelating agent, poly(acrylic acid-co-maleic acid), and an oxidizing agent. This composition is designed to achieve a high removal rate of GST with low defectivity. The second patent focuses on a similar method but employs ethylene diamine tetra acetic acid and its salts as part of the polishing composition, also ensuring a high GST removal rate with minimal defects.
Career Highlights
Jaeseok Lee is currently associated with Rohm and Haas Electronic Materials CMP Holdings, Inc. His expertise in chemical mechanical polishing has positioned him as a key figure in the development of advanced materials for electronic applications. His contributions have been instrumental in enhancing the efficiency and effectiveness of polishing processes in the industry.
Collaborations
Jaeseok Lee has collaborated with notable coworkers such as Yi Guo and Kancharla-Arun Kumar Reddy. These collaborations have fostered a productive environment for innovation and have led to the successful development of new technologies in the field.
Conclusion
Jaeseok Lee's work in chemical mechanical polishing has made a significant impact on the electronics materials industry. His innovative patents and collaborations highlight his dedication to advancing technology in this field.