Suwon, South Korea

Jae Won Hwang

This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignees: Samsung Electronics Ltd., Other. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Won Hwang. Retrieved from https://idiyas.com/inventor/jae-won-hwang-kq5wi8m4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2011-2026

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2 patents (USPTO):Explore Patents

Title: Jae Won Hwang: Semiconductor and Illumination Innovations.

Introduction

Jae Won Hwang is an inventor associated with Suwon, South Korea. His recorded work spans semiconductor device manufacturing and illumination control. He is credited with 2 patents.

Latest Patents

One of Hwang’s patents describes a method for manufacturing a semiconductor device and a device manufactured using that method. The process forms lower and upper chips, each with interlayer insulating and adhesive films. Trenches are etched into the films, and seed films are formed using sputtering before the chips are bonded together.

Another patent concerns an illumination control apparatus that uses pulsating waves. It varies the power supplied to fluorescent-light stabilizers, enabling illumination control without requiring changes to conventional lighting installations or power-system construction. The apparatus can also supply power to multiple stabilizers, subject to its capacity.

Career Highlights

Hwang’s listed company affiliation includes Samsung Electronics. His patent work reflects contributions to both semiconductor fabrication and practical lighting control.

Collaborations

His named coworkers include Sung Hyun Baik and Jun Kyoung Lee.

Conclusion

Jae Won Hwang’s recorded inventions address two distinct engineering challenges: bonding semiconductor chips through a sputtering-based manufacturing process and controlling illumination with pulsating power.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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