Company Filing History:
Years Active: 2011-2014
Title: Jae-Shin Cho: Innovator in Semiconductor Package Technology
Introduction: Jae-Shin Cho is a prominent inventor based in Yongin-si, South Korea, recognized for his significant contributions to the field of semiconductor packages. With two patents to his name, Cho has demonstrated a commitment to advancing technology in this critical area of electronics.
Latest Patents: His most recent patents focus on innovative semiconductor packages and methods of manufacturing them. The first patent addresses the design of semiconductor packages that comprise a substrate with a chip pad and a redistributed line for electrical connectivity. This invention effectively mitigates problems associated with gold diffusion into bump pads, which can lead to voids and undesirable intermetallic compounds. In a chip-on-chip structure, this design enhances reliability and functionality by interconnecting multiple bumps between lower and upper chips.
The second patent details a semiconductor package engineered for improved joint reliability, featuring a method of fabrication that includes a conductive connector on the surface of a semiconductor wafer. This approach incorporates multiple insulating layers with strategic openings that expose portions of wiring lines, allowing for the integration of entangled wires for enhanced electrical connectivity.
Career Highlights: Jae-Shin Cho is currently employed at Samsung Electronics Co., Ltd., a global leader in electronics and technology. His work in semiconductor packaging not only showcases his inventive prowess but also aligns with his company’s goal of pioneering advancements in electronic components.
Collaborations: Throughout his career, Cho has collaborated with accomplished colleagues such as Hyun-Soo Chung and Seong-deok Hwang. Their collective efforts reflect a shared dedication to advancing semiconductor technology and improving product reliability.
Conclusion: Jae-Shin Cho stands out as an innovative inventor whose work in semiconductor package technology addresses crucial challenges in the industry. With his patents demonstrating a blend of technical expertise and practical solutions, he contributes significantly to the evolving landscape of electronics manufacturing. His ongoing contributions at Samsung Electronics Co., Ltd. position him as a key player in the field.