This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Posco. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Innovations of Jae-Ryung Lee in Flexible Electronic Devices
Introduction
Jae-Ryung Lee is an accomplished inventor based in Incheon, South Korea. He has made significant contributions to the field of flexible electronic devices, particularly through his innovative patent that enhances heat dissipation properties.
Latest Patents
Jae-Ryung Lee holds a patent for a "Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant." This invention focuses on a metal encapsulant that exhibits excellent flexibility, moisture resistance, workability, and heat dissipation properties. The encapsulant is designed by forming a coating layer that includes a metal graphite composite on one surface, which significantly improves the performance of flexible electronic devices.
Career Highlights
Jae-Ryung Lee is currently associated with Posco, a leading company in the materials industry. His work at Posco has allowed him to explore and develop advanced materials that contribute to the evolution of electronic devices.
Collaborations
He has collaborated with notable colleagues such as Young-Jun Park and Kyoung-Bo Kim, who share his passion for innovation in the field of electronics.
Conclusion
Jae-Ryung Lee's contributions to the development of flexible electronic devices through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile