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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10044003 B1

PDFFull Text
Date of Patent:
Aug. 07, 2018

Filed:

Dec. 19, 2014

Metal encapsulant having good heat dissipation properties, method of manufacturing same, and flexible electronic device encapsulated in said metal encapsulant

Applicant:

Posco, Pohang-si, Gyeongsangbuk-do, KR;

Inventors:

Young-Jun Park, Incheon, KR;

Kyoung-Bo Kim, Incheon, KR;

Moo-Jin Kim, Incheon, KR;

Soo-Cherl Lee, Gwangyang-si, KR;

Jae-Ryung Lee, Incheon, KR;

Assignee:

POSCO, Pohang-si, Gyeongsangbuk-do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
H01L 51/52 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/40 (2006.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01L 51/529 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); B32B 15/08 (2013.01); B32B 27/283 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/322 (2013.01); B32B 27/40 (2013.01); H01L 51/448 (2013.01); H01L 51/524 (2013.01); H01L 51/5243 (2013.01); B32B 2307/306 (2013.01); B32B 2307/7265 (2013.01); B32B 2439/00 (2013.01); B32B 2457/00 (2013.01); Y02E 10/549 (2013.01);
Abstract

The present invention relates to a metal encapsulant having good heat dissipation properties, a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant, and particularly, to a metal encapsulant having excellent flexibility, moisture resistance, workability, and heat dissipation properties by forming a coating layer including a metal graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device encapsulated in said metal encapsulant.

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