Jae Ouk Choo

Title: Innovations by Jae Ouk Choo in Chemical Mechanical Polishing

Introduction

Jae Ouk Choo is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of chemical mechanical polishing (CMP). With a total of 6 patents, he has made significant advancements in the methods and compositions used for shallow trench isolation (STI) applications.

Latest Patents

Choo's latest patents focus on the development of chemical mechanical polishing compositions specifically designed for shallow trench isolation applications. His innovative methods aim to remove, reduce, or treat trace metal contaminants and fine-sized cerium oxide particles from cerium oxide slurries or CMP compositions. The treated CMP compositions are utilized to polish substrates that include surfaces with silicon dioxide films, which are essential for STI processing. Notably, his work has led to the observation of reduced nano-sized particle-related defects due to the diminished presence of trace metal ion contaminants and smaller fine cerium oxide particles in the CMP polishing process.

Career Highlights

Throughout his career, Jae Ouk Choo has worked with prominent companies such as Air Products and Chemicals, Inc. and Versum Materials US, LLC. His experience in these organizations has contributed to his expertise in the field of chemical mechanical polishing and its applications in semiconductor manufacturing.

Collaborations

Choo has collaborated with several professionals in his field, including Xiaobo Shi and James Allen Schlueter. These collaborations have further enhanced his research and development efforts in CMP technologies.

Conclusion

Jae Ouk Choo's innovative work in chemical mechanical polishing has significantly impacted the semiconductor industry, particularly in shallow trench isolation applications. His patents and career achievements reflect his dedication to advancing technology in this critical area.