Jae O Choo

Title: Jae O Choo: Innovator in Interconnect Technology

Introduction

Jae O Choo is a notable inventor based in Clifton Park, NY (US). She has made significant contributions to the field of integrated circuit (IC) technology. Her innovative work focuses on methods for forming interconnects in ICs, which are crucial for the performance and efficiency of electronic devices.

Latest Patents

Jae O Choo holds a patent for "Interconnect formation with chamferless via, and related interconnect." This patent describes methods of forming an interconnect of an IC, which includes the formation of a first interlayer dielectric (ILD) layer and a second ILD layer with an ILD etch stop layer (ESL) in between. The ESL has an etch rate that is at least five times slower than that of the first and second ILD layers, potentially utilizing materials such as aluminum oxynitride. A dual damascene hard mask is employed to create a wire trench opening in the second ILD layer and a via opening in the first ILD layer, resulting in a via-wire opening. The slower etch rate allows the ESL to define the via opening in the first ILD layer as a chamferless via opening. A unitary via-wire conductive structure can then be formed from this opening.

Career Highlights

Jae O Choo is currently employed at GlobalFoundries Inc., where she continues to advance her research and development in semiconductor technology. Her work has been instrumental in improving the efficiency and reliability of interconnects in integrated circuits.

Collaborations

Throughout her career, Jae has collaborated with esteemed colleagues, including Martin O'Toole and Christopher J. Penny. These collaborations have further enhanced her contributions to the field of IC technology.

Conclusion

Jae O Choo is a pioneering inventor whose work in interconnect technology has the potential to significantly impact the electronics industry. Her innovative methods and dedication to research exemplify the spirit of invention in the modern technological landscape.