Seoul, South Korea

Jae-Kul Lee

This inventor holds 8 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2008-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae-Kul Lee. Retrieved from https://idiyas.com/inventor/jae-kul-lee-r48b7vuq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 50.0

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 63(Granted Patents)


Location History:

  • Seoul, KR (2008 - 2015)
  • Sejong, KR (2018)

Company Filing History:


Years Active: 2008-2018

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8 patents (USPTO):Explore Patents

Title: Innovations of Jae-Kul Lee

Introduction

Jae-Kul Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of electronics, particularly in the manufacturing of insulation films and printed circuit boards. With a total of 8 patents to his name, Lee's work has had a substantial impact on the industry.

Latest Patents

One of his latest patents is a method of manufacturing insulation film. This method involves coating a resin composite on a lower protective film, where the resin composite includes an inorganic filler dispersed within it. The process continues by forming an insulating layer through the drying of the resin composite, allowing the inorganic filler to precipitate. An upper protective film is then laminated onto the insulating layer.

Another notable patent is a method of manufacturing a printed circuit board (PCB) that features an embedded bare chip. This method includes attaching a tape to one side of an insulated substrate with a penetration hole. The bare chip is then attached to the tape inside the hole, ensuring that the electrode pads of the chip face the tape. The hole is filled with a filler, and the tape is subsequently removed. A metal layer is laminated onto the surface of the filler and the insulated substrate, followed by the formation of electrode bumps by removing portions of the metal layer. This process also includes the simultaneous removal of metal layer portions while forming a circuit pattern on one side of the insulated substrate.

Career Highlights

Jae-Kul Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic components.

Collaborations

Lee has collaborated with notable coworkers, including Doo-Hwan Lee and Moon-Il Kim, contributing to various projects and innovations within the company.

Conclusion

Jae-Kul Lee's contributions to the field of electronics through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key innovator in the industry. His methods for manufacturing insulation films and printed circuit boards demonstrate his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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