The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Aug. 29, 2007
Doo-hwan Lee, Suwon-si, KR;
Seung-gu Kim, Suwon-si, KR;
Won-cheol Bae, Pyeongtaek-si, KR;
Moon-il Kim, Daeleon, KR;
Jae-kul Lee, Seoul, KR;
Doo-Hwan Lee, Suwon-si, KR;
Seung-Gu Kim, Suwon-si, KR;
Won-Cheol Bae, Pyeongtaek-si, KR;
Moon-Il Kim, Daeleon, KR;
Jae-Kul Lee, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.