Seung-Gu Kim

Title: Seung-Gu Kim: Innovator in Printed Circuit Board Technology

Introduction

Seung-Gu Kim is a prominent inventor based in Chungcheongbuk-do, South Korea. He has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 3 patents. His innovative methods have advanced the manufacturing processes of PCBs, making them more efficient and effective.

Latest Patents

One of his latest patents is a method of manufacturing a component-embedded printed circuit board. This method involves mounting a component on a first copper foil, stacking an insulation layer with a cavity, and connecting the copper foils through conductive protrusions. This process allows for the creation of thin printed circuit boards, particularly when embedding flip chip type components. Another notable patent is for a multi-layer printed circuit board that utilizes a metal substrate as a core member. This method includes anodizing the substrate, forming inner layer circuits, and embedding electronic components, resulting in a sophisticated multi-layer circuit design.

Career Highlights

Seung-Gu Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in enhancing the capabilities of PCBs, which are essential components in various electronic devices.

Collaborations

Throughout his career, Seung-Gu Kim has collaborated with notable colleagues, including Je-Gwang Yoo and Jae-Kul Lee. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Seung-Gu Kim's contributions to printed circuit board technology have established him as a key figure in the industry. His innovative patents and collaborative efforts continue to shape the future of electronics.