This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jae-Hwang Sim’s Semiconductor Inventions
Introduction
Jae-Hwang Sim is an inventor based in Suwon-si, South Korea, whose patent work focuses on semiconductor devices and three-dimensional memory technology. The supplied information lists 2 patents and identifies Samsung Electronics as Sim’s company.
Latest Patents
Sim’s listed patents address semiconductor memory structures and their fabrication.
“Semiconductor device, electronic system including the same, and method of fabricating the same” describes a semiconductor device with a gate stack, a memory channel structure, a through contact, and a connection contact. The disclosed design specifies that the memory portion has a smaller minimum width than the through and connection portions.
“Three-dimensional (3D) semiconductor memory device, method of manufacturing the same, and electronic system including the same” describes a 3D memory device with a source structure, an alternating stack of insulating and conductive patterns, a through-plug, and a pad. Its design includes distinct extension and parallel portions of the through-plug, and specifies that the pad is shorter in height than a conductive pattern.
Career Highlights
The supplied information associates Sim with Samsung Electronics and highlights patent contributions in semiconductor devices, memory architecture, and manufacturing methods. These inventions also describe how memory structures can be integrated into electronic systems.
Collaborations
Shinhwan Kang and Yejin Park are identified as Sim’s coworkers. The provided information does not specify their roles in the listed patents.
Conclusion
Jae-Hwang Sim’s listed patent work centers on semiconductor and 3D memory designs, including device structures and methods of fabrication.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
