This inventor holds 1 USPTO granted patent. Top assignee: Iowa State University Research Foundation Inc.. Active years: 2003.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003
Title: Jae Hwang Lee and Photonic Band Gap Materials
Introduction
Jae Hwang Lee is an inventor associated with Ames, Iowa, and Iowa State University Research Foundation Inc. His work includes a patented method for fabricating photonic band gap materials using microtransfer-molded templates.
Latest Patents
Lee is credited with 1 patent: “Fabrication of Photonic Band Gap Materials Using Microtransfer Molded Templates.” The invention describes a process for manufacturing photonic band gap structures designed to operate in the optical spectrum.
The method begins by creating a patterned template and forming an elastomeric mold from polydimethylsiloxane (PDMS) or another suitable polymer. A second polymer, such as epoxy, is placed in the mold and stamped onto a substrate or multilayer structure. After the mold is removed, the structure is infiltrated with ceramic or metal and heated to remove the second polymer, leaving a photonic band gap structure.
Career Highlights
Lee’s patent focuses on a template-based fabrication approach that combines polymer molding, material infiltration, and heat treatment. The process is intended to produce structures with potential applications in optical technologies.
Collaborations
Lee’s listed coworkers include Henry Kang and David Cann. His patent is associated with Iowa State University Research Foundation Inc.
Conclusion
Jae Hwang Lee’s patented fabrication method presents a structured approach to producing photonic band gap materials for optical applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile