Company Filing History:
Years Active: 2016-2018
Title: Innovations by Jae Bong Shin in Semiconductor Manufacturing
Introduction
Jae Bong Shin is a notable inventor based in Gunpo-si, South Korea. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of bonding processes in semiconductor devices.
Latest Patents
One of Jae Bong Shin's latest patents is titled "Bonding stage and bonding apparatus comprising the same." This invention features a bonding stage that includes a first heater and a second heater, each independently operated, to optimize the bonding process of semiconductor chips on a substrate. Additionally, he has developed a patent for "Semiconductor manufacturing apparatuses comprising bonding heads." This apparatus includes a pickup unit for handling chips and a bonding head that facilitates the precise placement of chips onto circuit boards, ensuring high-quality manufacturing.
Career Highlights
Jae Bong Shin is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics and semiconductor industry. His innovative work has contributed to advancements in semiconductor technology, making processes more efficient and reliable.
Collaborations
Throughout his career, Jae Bong Shin has collaborated with esteemed colleagues, including Byung Joon Lee and Seung-Dae Seok. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Jae Bong Shin's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor technology.