Samsung Electronics Co., Ltd.

Jae Bong Shin

Byung Joon Lee

Sang-Yoon Kim

Hui Jung Kim

Masato Kajinami

Yoshiaki Yukimori

Seung Dae Seok

Hui-Jae Kim

Sang Yoon Kim

Byeong Kap Choi

Seung-Dae Seok

Byeong-Kuk Park

A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

Bonding stage and bonding apparatus comprising the same

A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Semiconductor manufacturing apparatuses comprising bonding heads

Growing community of inventors

Gunpo-si, South Korea

Jae Bong Shin