Jeonju-si, South Korea

Jae Bok Yoo


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Jae Bok Yoo

Introduction

Jae Bok Yoo is a notable inventor based in Jeonju-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Jae Bok Yoo holds a patent for a "Method of manufacturing stacked package." This method involves several intricate processes, including stacking a semiconductor chip on a printed circuit board (PCB), forming a photoresist layer, and creating a via-hole on the via-hole pad. His invention enhances the efficiency and effectiveness of semiconductor packaging.

Career Highlights

Jae Bok Yoo is associated with Sts Semiconductor & Telecommunications Co., Ltd., where he applies his expertise in semiconductor manufacturing. His work has contributed to advancements in the industry, showcasing his skills and knowledge in this specialized field.

Collaborations

Some of his coworkers include Hyun Hak Jung and Kyoung Min Song, who collaborate with him on various projects within the company.

Conclusion

Jae Bok Yoo's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in advancing modern technology. His contributions continue to influence the industry positively.

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