This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Sts Semiconductor & Telecommunications Co., Ltd.. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: The Innovative Contributions of Jae Bok Yoo
Introduction
Jae Bok Yoo is a notable inventor based in Jeonju-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Jae Bok Yoo holds a patent for a "Method of manufacturing stacked package." This method involves several intricate processes, including stacking a semiconductor chip on a printed circuit board (PCB), forming a photoresist layer, and creating a via-hole on the via-hole pad. His invention enhances the efficiency and effectiveness of semiconductor packaging.
Career Highlights
Jae Bok Yoo is associated with Sts Semiconductor & Telecommunications Co., Ltd., where he applies his expertise in semiconductor manufacturing. His work has contributed to advancements in the industry, showcasing his skills and knowledge in this specialized field.
Collaborations
Some of his coworkers include Hyun Hak Jung and Kyoung Min Song, who collaborate with him on various projects within the company.
Conclusion
Jae Bok Yoo's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in advancing modern technology. His contributions continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile