Jacques Chavade

Title: Jacques Chavade: Innovator in Electronic Packaging

Introduction

Jacques Chavade is a notable inventor based in Moirans, France. He has made significant contributions to the field of electronic packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in semiconductor components and electrical connection boards.

Latest Patents

One of Jacques Chavade's latest patents is for a dual side package on package. This electronic package features a substrate wafer with an interconnect network. A first chip is affixed to the front of the substrate, connected to the interconnect network, and encapsulated by a body. A second chip is positioned on the back side of the substrate wafer, connected to the interconnect network by back-side connection elements. These elements are interposed between the back side of the substrate and the front side of the second chip. Additionally, front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body, allowing for efficient mounting on a board with thermally conductive material.

Another significant patent involves an electrical connection board designed for semiconductor components. This board includes electrical connection terminals arranged in a square matrix, facilitating connections with semiconductor components. The terminals are organized in a way that allows for efficient electrical connections through adjacent connection groups. The design ensures that the terminals of a group are offset by one pitch relative to adjacent groups, enhancing the overall functionality of the board.

Career Highlights

Jacques Chavade has worked with prominent companies in the electronics industry, including STMicroelectronics. His experience at STMicroelectronics (Grenoble 2) has further solidified his expertise in electronic packaging and semiconductor technology.

Collaborations

Throughout his career, Jacques has collaborated with talented individuals such as Pierre Bormann and Luc Morineau. These collaborations have contributed to the development of innovative solutions in the field of electronics.

Conclusion

Jacques Chavade's contributions to electronic packaging and semiconductor technology are noteworthy. His patents reflect a commitment to innovation and advancement in the industry. His work continues to influence the design and functionality of electronic components.