Stmicroelectronics S.a.

Stmicroelectronics (grenoble 2) Sas

Cogito Instruments Sa

Jacques Chavade

Pierre Bormann

Luc Morineau

Romain Coffy

Eric Saugier

Luc Petit

Rémi Brechignac

Dominique Marais

Bruno Bailly

ÖRs Málnási-Csizmadia

Boriana Petrova

An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Dual side package on package

An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip

A device is provided for electrically connecting an integrated circuit chip. The device includes a main board, an intermediate board, and electrical connection balls in a space separating the boards. In the space, a peripheral zone comprises a peripheral matrix of balls, a central zone comprises a central matrix of balls, a first secondary zone comprises a matrix of electrical connection vias linked to the balls of the two adjacent rows of balls of the peripheral matrix, and a second secondary zone comprises a matrix of electrical connection vias linked to balls of the central matrix. The first secondary zone and the second secondary zone are separated by an intermediate zone that includes at least a first part having at least one complementary row of electrical connection balls, and a second part having complementary electrical connection vias linked to the balls of this complementary row.

Device for electrical connection of an integrated circuit chip

Growing community of inventors

Moirans, France

Jacques Chavade