Jacob L Smith

Title: Jacob L Smith: Innovator in Copper Alloy Technology

Introduction

Jacob L Smith is a notable inventor based in Sunnyvale, California. He has made significant contributions to the field of materials science, particularly in the development of advanced copper alloys. His innovative work has led to the creation of a patented technology that enhances the performance of metallic components.

Latest Patents

Jacob L Smith holds a patent for a "Copper alloy film with high strength and high conductivity." This invention describes a method of forming a component by electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material includes crystal grains, with at least 90% of these grains featuring nanotwin boundaries. Specifically, the metallic material can consist of a Copper-Silver alloy (Cu—Ag) with an Ag concentration ranging from about 0.5 to 2 atomic percent.

Career Highlights

Jacob is currently employed at Apple Inc., where he applies his expertise in materials science to develop cutting-edge technologies. His work at Apple has positioned him as a key player in the advancement of electronic components, contributing to the company's reputation for innovation.

Collaborations

Jacob has collaborated with esteemed colleagues such as Herng-Jeng Jou and Weiming Huang. Their combined efforts have fostered a productive environment for research and development, leading to breakthroughs in the field of metallic materials.

Conclusion

Jacob L Smith's contributions to the field of copper alloy technology exemplify the spirit of innovation. His patented work not only enhances the performance of materials but also reflects the collaborative nature of research in the tech industry.