The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2024
Filed:
May. 02, 2022
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Herng-Jeng Jou, San Jose, CA (US);
Jacob L. Smith, Sunnyvale, CA (US);
Weiming Huang, State College, PA (US);
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C23C 14/14 (2006.01); C23C 14/34 (2006.01); C25D 3/38 (2006.01); H01M 4/02 (2006.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C23C 14/14 (2013.01); C23C 14/34 (2013.01); C25D 3/38 (2013.01); H01M 4/662 (2013.01); H01M 10/0525 (2013.01); C22C 2200/00 (2013.01); H01M 2004/021 (2013.01);
Abstract
A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.