This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Jack Monjay Yao: Innovator in Integrated Circuit Design
Introduction
Jack Monjay Yao is a notable inventor based in San Diego, CA. He has made significant contributions to the field of integrated circuit design. His innovative approach has led to the development of a unique patent that enhances the analysis of integrated circuits during the early design phase.
Latest Patents
Jack Monjay Yao holds a patent titled "Statistical integrated circuit package modeling for analysis at the early design age." This patent focuses on a method for generating a set of lumped circuit parameter values associated with die bumps on an integrated circuit. The method utilizes distances between the die bumps and the center of the die, along with sample-data distribution functions for both die bump distance variables and lumped circuit parameter variables. This innovative approach allows for more accurate modeling and analysis in the design process.
Career Highlights
Jack is currently employed at Qualcomm Incorporated, a leading company in the telecommunications industry. His work at Qualcomm has allowed him to apply his expertise in integrated circuit design and contribute to cutting-edge technology.
Collaborations
Jack collaborates with Xiaoming Chen, a fellow innovator in the field. Their partnership exemplifies the spirit of teamwork and innovation that drives advancements in technology.
Conclusion
Jack Monjay Yao's contributions to integrated circuit design through his patent and work at Qualcomm highlight his role as an influential inventor. His innovative methods are paving the way for future advancements in the field.