The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Jun. 11, 2009
Applicants:
Xiaoming Chen, San Diego, CA (US);
Jack Monjay Yao, San Diego, CA (US);
Inventors:
Xiaoming Chen, San Diego, CA (US);
Jack Monjay Yao, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
In designing an integrated circuit on a die having a set of die bumps, a method to generate a set of lumped circuit parameter values associated with the set of die bumps, based upon distances between the set of die bumps and the center of the die, the method also based upon a sample-data distribution function of a die bump distance variable and a sample-data distribution function of a lumped circuit parameter variable. Other embodiments are described and claimed.