Phoenix, AZ, United States of America

Jack Hu

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jack Hu. Retrieved from https://idiyas.com/inventor/jack-hu-snq5aok3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Jack Hu - Innovator in Cooling Technology

Introduction

Jack Hu is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of technology, particularly in the area of cooling systems for ultramobile devices. His innovative approach has led to the development of a unique patent that addresses the challenges of heat management in compact electronic devices.

Latest Patents

Jack Hu holds a patent for "Microfins for cooling an ultramobile device." This invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the device. This innovative cooling solution enhances the performance and longevity of ultramobile devices by effectively dissipating heat.

Career Highlights

Jack Hu is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing and computing technology. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his expertise and contributions to technology.

Collaborations

Some of Jack's coworkers include George K Chen and Hakan Erturk. Their collaborative efforts contribute to the innovative environment at Intel Corporation, fostering advancements in technology and product development.

Conclusion

Jack Hu's contributions to cooling technology for ultramobile devices exemplify the spirit of innovation. His patent and work at Intel Corporation highlight his commitment to enhancing electronic device performance through effective heat management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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