J Stan Erickson

Title: J Stan Erickson: Innovator in Printed Wiring Board Technology

Introduction

J Stan Erickson is a notable inventor based in Cary, NC (US). He has made significant contributions to the field of printed wiring board (PWB) technology. His innovative approach focuses on integrating thin-film capacitors into the build-up layers of PWBs, which enhances their performance and reliability.

Latest Patents

Erickson holds a patent titled "Methods for integration of thin-film capacitors into the build-up layers of a PWB." This patent describes devices comprising a printed wiring board that includes singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. The methods outlined in the patent aim to incorporate these singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The design allows each power and ground terminal of an integrated circuit (IC) to be directly connected to a power and ground electrode of its own singulated capacitor. Utilizing a feedstock of known good, fired-on-foil capacitors contributes to improved PWB yield.

Career Highlights

Erickson is currently employed at E.I. DuPont de Nemours and Company, where he continues to innovate in the field of electronics. His work has had a lasting impact on the design and functionality of printed wiring boards.

Collaborations

Throughout his career, Erickson has collaborated with notable colleagues, including William J Borland and Daniel I Amey, Jr. These partnerships have fostered advancements in technology and innovation within the industry.

Conclusion

J Stan Erickson's contributions to printed wiring board technology exemplify the importance of innovation in electronics. His patent on integrating thin-film capacitors showcases his commitment to enhancing PWB performance. His work continues to influence the field and inspire future advancements.