The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2010

Filed:

Jun. 19, 2007
Applicants:

William Borland, Chapel Hill, NC (US);

Daniel I. Amey, Jr., Durham, NC (US);

Karl H. Dietz, Raleigh, NC (US);

Cengiz Ahmet Palanduz, Durham, NC (US);

J. Stan Erickson, Cary, NC (US);

Inventors:

William Borland, Chapel Hill, NC (US);

Daniel I. Amey, Jr., Durham, NC (US);

Karl H. Dietz, Raleigh, NC (US);

Cengiz Ahmet Palanduz, Durham, NC (US);

J. Stan Erickson, Cary, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power and ground terminal of an IC to be directly connected to a power and ground electrode, respectively, of its own singulated capacitor. Using a feedstock of known good, fired-on-foil capacitors allows for improved PWB yield.


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