Daniel I Amey, Jr

Title: The Innovations of Daniel I Amey, Jr.

Introduction

Daniel I Amey, Jr. is an accomplished inventor based in Durham, NC (US). He has made significant contributions to the field of printed wiring boards (PWBs) through his innovative patent. His work focuses on enhancing the integration of thin-film capacitors, which plays a crucial role in modern electronic devices.

Latest Patents

Daniel I Amey, Jr. holds a patent titled "Methods for integration of thin-film capacitors into the build-up layers of a PWB." This patent describes devices that comprise a printed wiring board featuring singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. The methods outlined in the patent aim to minimize impedance by incorporating these singulated capacitors into the build-up layers of a printed wiring board. The design allows each power and ground terminal of an integrated circuit (IC) to be directly connected to its own singulated capacitor, thereby improving the overall yield of the printed wiring board.

Career Highlights

Throughout his career, Daniel has worked with notable companies, including E.I. DuPont De Nemours and Company and Cda Processing Limited Liability Company. His experience in these organizations has contributed to his expertise in the field of electronics and materials science.

Collaborations

Daniel has collaborated with several professionals in his field, including Cengiz Ahmet Palanduz and J Stan Erickson. These collaborations have likely enriched his work and led to further advancements in his projects.

Conclusion

Daniel I Amey, Jr. is a notable inventor whose work in the integration of thin-film capacitors has the potential to significantly impact the electronics industry. His innovative approaches and collaborations highlight his commitment to advancing technology in printed wiring boards.