Company Filing History:
Years Active: 2003-2005
Title: J Patrick Rymer: Innovator in Semiconductor Processing
Introduction
J Patrick Rymer is a notable inventor based in Livermore, CA (US). He has made significant contributions to the field of semiconductor processing, particularly in the deposition of thin films. With a total of 2 patents to his name, Rymer's work has advanced the technology used in copper interconnects.
Latest Patents
Rymer's latest patents focus on the apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing. This innovative method involves depositing thin films comprising tantalum, tantalum nitride, and copper for barrier films and seed layers within high aspect ratio openings. The process is conducted at extremely low temperature conditions, with the wafer stage temperature of the sputter source chilled to about -70°C to about 0°C. The use of a hollow cathode magnetron in this process results in tantalum and/or tantalum nitride barrier films and copper seed layers that exhibit superior surface smoothness, grain size, and uniformity, ensuring that subsequent filling of the high aspect ratio openings is substantially void-free.
Career Highlights
J Patrick Rymer is currently employed at Novellus Systems Incorporated, where he continues to innovate in the semiconductor industry. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.
Collaborations
Rymer has collaborated with notable colleagues such as Kaihan Abidi Ashtiani and Maximilian Albert Biberger, contributing to the advancement of semiconductor technologies.
Conclusion
J Patrick Rymer's contributions to semiconductor processing through his innovative patents and collaborations highlight his role as a key inventor in the field. His work continues to influence the development of advanced technologies in the industry.