This inventor holds 2 USPTO granted patents. Top assignees: Amkor Technology, Inc., Other. Active years: 2001-2002.
Company Filing History:
1 out of 1,009 
1 out of 834,350 Years Active: 2001-2002
Title: J H Yee: Innovator in Integrated Circuit Packaging
Introduction
J H Yee is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase his innovative approaches.
Latest Patents
His latest patents include methods for molding a leadframe in plastic integrated circuit devices. These methods involve creating packages that consist of a die, a die pad, leads, bond wires, and an encapsulant. The design features a stepped profile on the lower surfaces of the die pad and leads, achieved through a partial etching process. This etching allows the encapsulant material to fill in beneath the recessed surfaces, ensuring that the die pad and leads remain securely connected to the package body. After encapsulation, the die pad and leads are severed from the leadframe, allowing for the production of individual packages, which can be made one at a time or in bulk.
Career Highlights
Throughout his career, J H Yee has worked with prominent companies, including Amkor Technology, Inc. His expertise in integrated circuit packaging has positioned him as a key player in the industry.
Collaborations
He has collaborated with notable coworkers such as Thomas P Glenn and David T Roman, contributing to advancements in the field.
Conclusion
J H Yee's innovative work in integrated circuit packaging has led to significant advancements in the industry. His patents reflect a deep understanding of the complexities involved in creating reliable and efficient electronic components.