Tokyo, Japan

Iwao Ichikawa


Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 124(Granted Patents)


Location History:

  • Kanagawa, JP (1982 - 1984)
  • Yokohama, JP (1984)
  • Tokyo, JP (1982 - 1997)

Company Filing History:


Years Active: 1982-1997

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7 patents (USPTO):Explore Patents

Title: Iwao Ichikawa: Innovator in Thermocompression Bonding Technology

Introduction

Iwao Ichikawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of thermocompression bonding technology, holding a total of 7 patents. His work has been instrumental in advancing the efficiency and accuracy of bonding processes in various applications.

Latest Patents

Ichikawa's latest patents include innovative thermocompression bonding equipment designed to facilitate easy replacement and preparation of compression bonding heads. This equipment reduces the working time required for adjustments and simplifies the overall process. Additionally, he has developed a thermocompression bonding apparatus that ensures high accuracy in connecting object parts, even under high pressure. This apparatus is capable of bonding large members at fine pitches with remarkable precision. His inventions also encompass a thermocompression bonding method and a process for manufacturing liquid crystal display devices.

Career Highlights

Iwao Ichikawa is currently employed at Sony Corporation, where he continues to push the boundaries of technology in his field. His expertise in thermocompression bonding has made him a valuable asset to the company and the industry at large.

Collaborations

Ichikawa has collaborated with notable colleagues, including Norio Kawatani and Kazuaki Suzuki. Their combined efforts have contributed to the development of advanced bonding technologies.

Conclusion

Iwao Ichikawa's innovative work in thermocompression bonding technology has significantly impacted the industry. His patents reflect a commitment to enhancing the efficiency and accuracy of bonding processes, making him a key figure in this field.

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