Sony Corporation

Iwao Ichikawa

Yukio Yamada

Kazuaki Suzuki

Norio Kawatani

Teruyoshi Noda

Toshio Takahashi

Mitsuo Ohsawa

Katsumi Yamamoto

Kenichiro Kaimori

Yoshiteru Noda

This invention provides a thermocompression bonding equipment which, when the material to be bonded is to be changed, allows easy replacement and preparation of a compression bonding head, reduction of working time required for replacement and preparation of a compression bonding head, and simplified adjustment of the compression bonding head. The thermocompression bonding equipment is provided with a head unit 20 comprising a base 10, thermocompression bonding head 56 and sliding mechanism 50 for sliding the thermocompression bonding head 56 provided on the base 10, pressing means 30, which are structured independently from the head unit, for pressing the sliding mechanism 50 to slide the thermocompression bonding head 56, thereby thermocompression bonding the material of ACF, LCD, and TAB, and a base frame 40 provided with positioning means 40, 41 for positioning the base 10.

Thermocompression bonding equipment

A thermocompression bonding apparatus wherein object parts can be connected with a high degree of accuracy by thermocompression bonding and the entire apparatus is not deformed readily by a high pressure and a member of a large size can be connected at a fine pitch with a high degree of accuracy. The thermocompression bonding apparatus is constructed so as to bond a first member to a second member by thermocompression bonding and comprises a base member, a holding device for holding the second member thereon, a heat generation element for applying heat to the first member, and a pressurization member for pressing the heat generation element against the first member and the second member. The holding device, the heat generation element and the pressurization member are disposed mechanically separately from the base member. Also a thermocompression bonding method and a process of manufacturing a liquid crystal display device which are performed using the thermocompression bonding apparatus are disclosed.

Thermocompression bonding apparatus, thermocompression bonding method

Apparatus for feeding electric circuit elements includes a plurality of containers or stockers for electric circuit elements, a transfer member connected to a respective stocker for transferring the circuit elements, and a shutter assembly disposed across the feeding path of the transfer member, whereby a plurality of circuit elements are fed at one time by one stroke of the shutter assembly. The shutter assembly may have a cut-out portion at the edge thereof and is adjustably removable in a direction perpendicular to that of the stroke thereof to open the feeding paths which correspond to the cut-out portion. The stocker may include a receptacle, the bottom of which defines an opening to receive a capture member. The capture member has plural through holes extending axially therethrough and is opened at its conical top thereof to receive circuit elements by reciprocal movement of the capture member relative to the receptacle.

Apparatus for feeding electric circuit elements

An apparatus for feeding electric circuit elements has a hopper for accommodating a supply of such elements, a capture tube or pipe extending substantially vertically through a bore in the bottom of the hopper which is movable relative to the tube in the direction of the axis of the latter so that the electric circuit elements in the hopper are captured one at a time by the tube and fed therethrough to a predetermined position at the outside of the hopper, and a separating plate disposed above the opening of the tube in the hopper for shielding the electric circuit elements under the separating plate from at least part of the weight of the electric circuit elements thereabove whereby the hopper can be provided with a large vertical dimension for accommodating a correspondingly large supply of the electric circuit elements without the danger that elements near the bottom of the hopper will be damaged by reason of the relative movement of the capture tube under the weight of the superposed circuit elements. Jamming or bridging of the electrical circuit elements above or around the opening to the capture tube is avoided by providing the bottom of the hopper with a conically concave inner surface having a plurality of protuberances thereon, and further by providing a rod extending through the bottom of the hopper and being stationary relative to the capture tube so that the hopper is also movable relative to such rod which has a resilient member extending laterally therefrom over the opening to the capture tube.

An apparatus for locating chip type circuit elements on a printed circuit board includes an accommodating assembly for temporarily storing said circuit elements supplied from hoppers, a movable shutter placed under the accommodating assembly, and which supports and rotates circuit elements within the accommodating assembly, and a template placed under the shutter to receive the circuit elements dropped from the accommodating assembly when the shutter is removed laterally from under the accommodating assembly.

Apparatus for placing chip type circuit elements on a board

A hybrid integrated circuit is manufactured by

Method and apparatus for manufacturing hybrid integrated circuits

Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a prepositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.

Growing community of inventors

Tokyo, Japan

Iwao Ichikawa