Ritto, Japan

Issey Yamamoto


Average Co-Inventor Count = 2.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2010-2012

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2 patents (USPTO):Explore Patents

Title: Issey Yamamoto: Innovator in Multilayer Interconnection Technology

Introduction

Issey Yamamoto is a prominent inventor based in Ritto, Japan. He has made significant contributions to the field of multilayer interconnection technology, holding 2 patents that showcase his innovative approach to electronic components.

Latest Patents

Yamamoto's latest patents include a multilayer interconnection board and an internal conductor connection structure within a multilayer substrate. The multilayer interconnection board features a design that includes multiple laminated ceramic layers, with wiring electrodes placed on the principal surfaces. The unique aspect of this design is the arrangement of dot patterns around the wiring electrodes, which vary in density distribution. This allows for a higher presence of dot patterns near the wiring electrodes, decreasing as the distance increases. His second patent focuses on a multilayer substrate that incorporates an internal conductor connection structure. This structure consists of first and second via conductors positioned adjacent to each other, along with a first line conductor. The first via conductor is designed to extend away from the second via conductor and connects to the first line conductor through a continuous via conductor.

Career Highlights

Yamamoto is associated with Murata Manufacturing Co., Ltd., a leading company in the electronics industry. His work has significantly advanced the capabilities of multilayer substrates and interconnection technologies, contributing to the efficiency and performance of electronic devices.

Collaborations

Yamamoto has collaborated with notable colleagues, including Naoki Kaise and Yutaka Morikita. Their combined expertise has fostered innovation and development in their respective fields.

Conclusion

Issey Yamamoto's contributions to multilayer interconnection technology exemplify the spirit of innovation in the electronics industry. His patents reflect a deep understanding of complex electronic systems and a commitment to advancing technology.

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