The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2010

Filed:

Feb. 08, 2005
Applicants:

Issey Yamamoto, Ritto, JP;

Naoki Kaise, Okayama, JP;

Yutaka Morikita, Omihachiman, JP;

Inventors:

Issey Yamamoto, Ritto, JP;

Naoki Kaise, Okayama, JP;

Yutaka Morikita, Omihachiman, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multilayer substrate includes an internal conductor connection structure having first and second via conductors adjacent to each other in the multilayer substrate and a first line conductor disposed in the multilayer substrate. The first via conductor includes a first continuous via conductor arranged to extend in a direction away from the second via conductor, and the first via conductor is connected to the first line conductor through the first continuous via conductor.


Find Patent Forward Citations

Yamamoto, Issey. (2010). Internal conductor connection structure and multilayer substrate (U.S. Patent No. 7652213). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7652213

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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