Inwon O

Title: Inwon O: Innovator in Semiconductor Packaging

Introduction

Inwon O is a prominent inventor based in Hwasung-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.

Latest Patents

Inwon O holds a patent for a semiconductor package and the method of manufacturing it. This semiconductor package features a mold substrate that houses at least one semiconductor chip with chip pads. The design includes a redistribution wiring layer that covers the first surface of the mold substrate. This layer consists of a first redistribution wiring and a second redistribution wiring, which are stacked in at least two levels to ensure electrical connectivity to the chip pads. The first redistribution wiring incorporates a signal line in a designated region, while the second redistribution wiring contains a ground line that overlaps with the first region. Notably, the ground line is designed with multiple through holes of polygonal column shapes, enhancing its functionality.

Career Highlights

Inwon O is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of semiconductor technology, contributing to advancements that impact various electronic devices.

Collaborations

Inwon O has collaborated with notable colleagues, including Jaegwon Jang and Jongyoun Kim. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Inwon O's contributions to semiconductor packaging exemplify his dedication to innovation in the electronics field. His patent and work at Samsung Electronics Co., Ltd. highlight his role as a key player in advancing semiconductor technology.