Insup Shin

Title: The Innovations of Insup Shin

Introduction

Insup Shin is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on enhancing the reliability and efficiency of semiconductor packages.

Latest Patents

One of Insup Shin's latest patents is titled "Carrier structure including pockets for accommodating semiconductor chip stack structure." This invention features a carrier structure designed to hold semiconductor chip stack structures, incorporating a carrier tape with multiple pockets. Each pocket is meticulously designed with specific sidewalls to ensure the stability of the semiconductor chips.

Another notable patent is "Chip-stacked semiconductor package with increased package reliability." This innovation includes a base chip with a through via and multiple stacked chips, each connected through vias to enhance electrical connectivity. The design also incorporates molding layers that protect the chips, thereby increasing the overall reliability of the semiconductor package.

Career Highlights

Insup Shin is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Insup Shin has collaborated with notable coworkers, including Hyeongmun Kang and Jungmin Ko. Their combined expertise has fostered innovation and development in semiconductor technologies.

Conclusion

Insup Shin's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions continue to pave the way for advancements in semiconductor packaging and reliability.