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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11721601 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Nov. 11, 2020

Semiconductor package and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyeongmun Kang, Hwaseong-si, KR;

Jungmin Ko, Hwaseong-si, KR;

Seungduk Baek, Hwaseong-si, KR;

Taehyeong Kim, Suwon-si, KR;

Insup Shin, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

F. Chau & Associates, LLC

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/5385 (2013.01); H01L 24/13 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor package includes a substrate, a plurality of semiconductor devices stacked on the substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the substrate and the plurality of semiconductor devices, and molding resin surrounding the plurality of semiconductor devices. At least one of the underfill fillets is exposed from side surfaces of the molding resin.

Find Patent Forward Citations

Kang, Hyeongmun. (2023). Semiconductor package and method of manufacturing the same (U.S. Patent No. 11721601). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11721601

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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