Inhwa Baek

Title: Inhwa Baek - Innovator in Substrate Bonding Technology

Introduction

Inhwa Baek is an inventor based in Suwon-si, South Korea. He is known for his contributions to the field of semiconductor device manufacturing. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Inhwa Baek's recent patent applications include a "Substrate Bonding Apparatus and Method of Manufacturing Semiconductor Device Using the Same." This application describes a substrate bonding apparatus that features a first bonding chuck with a first base and a first transformation plate. The second bonding chuck includes a second base that faces the first bonding chuck. The first base is designed with a recess groove that is recessed inward from the surface where the first transformation plate is mounted. The first transformation plate has a protrusion that extends outward from its surface, allowing it to support a first substrate. The apparatus is designed to allow variable distances between the first transformation plate and the first base, enhancing its functionality. Another application titled "Substrate Bonding Apparatus" outlines a similar apparatus that includes a deformable plate to support a first substrate and a second bonding chuck that applies pressure to a second substrate. The design of the deformable plate allows for vertical deformation, which is crucial for effective substrate bonding.

Conclusion

Inhwa Baek's work in substrate bonding technology showcases his innovative approach to semiconductor manufacturing. His latest patent applications reflect his commitment to advancing this field, even as he seeks to secure granted patents in the future.