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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12580158 B1

PDFFull Text
Date of Patent:
Mar. 17, 2026

Filed:

Jul. 15, 2022

Plasma processing apparatus, substrate bonding system including the same, and substrate bonding method using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Inhwa Baek, Hwaseong-si, KR;

Donggap Shin, Seoul, KR;

Yongin Lee, Seoul, KR;

Se-Hoon Jang, Hwaseong-si, KR;

Youngho Kim, Gwangju-si, KR;

Ho Kim, Hwaseong-si, KR;

Seungdae Seok, Seongnam-si, KR;

Siwoong Woo, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Christopher T Schatz

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); H01J 37/32532 (2013.01); H01J 37/32862 (2013.01); H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/6833 (2013.01);
Abstract

Plasma processing apparatuses, substrate bonding systems, and substrate bonding methods are provided. The plasma processing apparatus includes a plasma process chamber that includes a process space, a load-lock chamber connected to the process space, a first vacuum pump that adjusts a pressure of the load-lock chamber, a process gas supply that supplies the process space with a process gas, and an HO supply that supplies the process space with HO. The plasma process chamber includes a chuck that supports a substrate and a plasma electrode to which a radio-frequency (RF) power is applied.

Find Patent Forward Citations

Baek, Inhwa. (2026). Plasma processing apparatus, substrate bonding system including the same, and substrate bonding method using the same (U.S. Patent No. 12580158). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12580158

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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