This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignees: Rohm & Haas Electronic Materials LLC, Dow Global Technolgoies LLC. Active years: 2014-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:


Years Active: 2014-2015
Title: Inho Lee: Innovator in Electroplating Technologies
Introduction
Inho Lee, a notable inventor based in Southborough, MA, has made significant contributions to the field of electroplating. With a total of two patents to his name, Lee specializes in developing innovative plating baths that enhance the quality of solder deposits. His work continues to have a positive impact on various manufacturing processes.
Latest Patents
Inho Lee's latest patents focus on advanced plating bath methodologies. One of his key inventions is a silver electroplating bath that incorporates specific sulfide compounds, enabling the electrodeposition of silver-containing layers. This innovation is particularly valuable, as it reduces void formation and enhances within-die uniformity in silver-containing solder deposits. Additionally, he has developed a tin-silver alloy electroplating bath featuring unique amine-oxide surfactants. This method allows for the production of tin-silver solder deposits with similar improvements in void formation and uniformity.
Career Highlights
Throughout his career, Inho Lee has worked with industry leaders such as Rohm and Haas Electronic Materials LLC and Dow Global Technologies LLC. His experience within these organizations has played a crucial role in refining his expertise and facilitating his innovative contributions to the electroplating sector.
Collaborations
Inho Lee has collaborated with talented professionals, including Elissei Iagodkine and Duane R. Romer. These partnerships have likely enriched his research efforts, fostering a collaborative environment that encourages technological advancements in electroplating.
Conclusion
Inho Lee stands out as an accomplished inventor whose work in developing sophisticated electroplating techniques has made a notable impact on the industry. His innovative approaches, along with valuable collaborations, continue to push the boundaries of technology in solder deposit applications. With each patent, Lee solidifies his legacy as a pioneer in the realm of electroplating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile