This inventor holds 4 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2005-2008.
Company Filing History:
Years Active: 2005-2008
Title: Ingo Uhlendorf: Innovator in 3D Structure Technologies
Introduction
Ingo Uhlendorf is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of technology, particularly in the development of methods for forming three-dimensional structures on substrates. With a total of 4 patents to his name, Uhlendorf's work is recognized for its innovative approaches and practical applications.
Latest Patents
Uhlendorf's latest patents include a method for forming three-dimensional structures on a substrate. This method involves placing a non-planar surface into an electrophoretic resist and applying an electrical voltage to facilitate the formation of a resist layer. Another notable patent is for a process and arrangement for the selective metallization of 3D structures. This process simplifies the selective gold-plating of 3D contact structures on wafers, enhancing the efficiency of electrical connections to carrier elements such as printed circuit boards.
Career Highlights
Ingo Uhlendorf is currently employed at Infineon Technologies AG, where he continues to push the boundaries of innovation in his field. His work has not only advanced the technology but has also contributed to the overall growth of the industry.
Collaborations
Uhlendorf has collaborated with notable colleagues, including Axel Brintzinger and Octavio Trovarelli. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Ingo Uhlendorf stands out as a key figure in the realm of 3D structure technologies. His innovative patents and collaborative efforts reflect his commitment to advancing the field. His contributions are likely to have a lasting impact on technology and its applications.